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MG Chemicals 9200FR Flame Retardant Structural Epoxy Adhesive, 25mL Dual Disp...
$ 10.43
- Description
- Size Guide
Description
MG Chemicals 9200FR Flame Retardant Structural Epoxy Adhesive, 25mL Dual DispenserProduct Details
Size: 25mL Dual Dispensor
Brand: MG Chemicals
MPN: 9200FR-25ML
UPC: Does not apply
EAN: Does not apply
Item Weight: 3.52 ounces
Shipping Weight: 1 pounds
Item model number: 9200FR-25ML
#121 in Acrylic Adhesives
Toughened, smooth, thixotropic paste
Flame RetardantMeets UL 94V-O Vertical Burn Test
Working life: 30 minutes, cure time: 24 hours
Non-sagging and gap filling
Very strong adhesion
Size:25mL Dual Dispensor The 9200FR Flame Retardant Structural Epoxy Adhesive is a two-part, flame retardant, thixotropic, toughened adhesive that is designed to create load bearing joints. It offers excellent adhesion to a wide range of difficult to bond to materials, including glass, ceramics, metals, engineered thermoplastics, and thermoset laminates such as SMC (sheet molding compound) and GRP (glass-reinforced plastics). The toughened adhesive protects against vibration damage when fully cured, but remains sufficiently flexible to accommodate thermal cycling stresses when bonding materials with different coefficients of thermal expansion. The 9200FR is electrically insulating and chemically resistant, which helps prevent corrosion damage. It has an excellent resistance to moisture, salt water, detergents, gasoline, hydraulic fluids, antifreeze, automotive fluids, acids, and bases. In addition, dissimilar metals can be bonded together without fear of causing galvanic corrosion because the adhesive prevents current flow through the bond. Applications & Usages: This adhesive is primarily used to create long-lasting, load-bearing joints, especially in situations where vibration resistance is key or where dissimilar materials are being joined. It is especially suitable for sheet molding compound (SMC) and glass-reinforced plastics (GRP) bonding. It is thixotropic, which makes it a great gap filler and is sag resistant—perfect for use on vertical surfaces. It is also excellent for encapsulating electronics enclosures with holes or seams where a non- thixotropic potting compound would flow through. It provides superior environmental protection and performs very well under temperature cycling.
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